Qualitative Simulation of the Growth of Electrolessly Deposited Cu Thin Films

Figure 4

The growth of Cu particles with (a) a low reaction rate 𝐹=15, (c) a reaction rate function 𝐹(𝑧) in (3.2), and (e) densely populated catalytic seeds. (b), (d), and (f) The in-plane growth and out-plane growth for deposition in (a), (c), and (e), respectively.

(a)

(b)

(c)

(d)

(e)

(f)