Transient Thermal-Electric Simulation and Experiment of Heat Transfer in Welding Tip for Reflow Soldering Process

Table 1

Material properties of copper alloy.

Properties (Unit)/	Specific heat	Thermal conductivity	Isotropic resistivity	Convection film coefficient
Temperature (°C)	(J/kg-°C)	(W/m- °C)	(-m)	(W/m^2-K)
25	385	401	1.69E-08	35
100	385	398	2.28E-08	35
Density		8,300 kg/m^3