Material Removal Mechanism and Evolution of Subsurface Defects during Nanocutting of Monocrystalline Cu

Figure 5

The variations of the von Mises stress and crystal structures with cutting distance of (a and c) 53.46 nm and (b and d) 72.9 nm. The subgraph (A–C) shows the distribution of the dislocation lines and subgrain boundaries in the three deformation zones, respectively.