Material Removal Mechanism and Evolution of Subsurface Defects during Nanocutting of Monocrystalline Cu

<table class="table-group" id="tab2"><tr><td><table class="table"><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr class="thead"><td class="align_left">Parameters</td><td class="align_center">Values</td></tr><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr><td class="align_left">Tool crystal structure</td><td class="align_center">Cubic diamond</td></tr><tr><td class="align_left">Tool thickness (<i>y</i>-direction)</td><td class="align_center">3.0 nm</td></tr><tr><td class="align_left">Take angle</td><td class="align_center">15°</td></tr><tr><td class="align_left">Flank angle</td><td class="align_center">8°</td></tr><tr><td class="align_left">Cutting direction</td><td class="align_center">(0 1 0) [<svg height="11.6608pt" id="M3" style="vertical-align:-0.04979992pt" version="1.1" viewbox="-0.0498162 -11.611 6.36303 11.6608" width="6.36303pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><rect height="0.65243" width="6.26339" x="0" y="-10.9087"></rect><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M384 0V27C293 34 287 42 287 114V635C232 613 172 594 109 583V559L157 557C201 555 205 550 205 499V114C205 42 199 34 109 27V0H384Z"></path></g></svg> 0 0]</td></tr><tr><td class="align_left">Cutting distance</td><td class="align_center">25 nm</td></tr><tr><td class="align_left">Cutting depth</td><td class="align_center">4.0 nm</td></tr><tr><td class="align_left">Timestep</td><td class="align_center">2 fs</td></tr><tr><td class="align_left">Relaxation time (NVT)</td><td class="align_center">50 ps</td></tr><tr class="table-tr"><td colspan="2"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>3D nanocutting parameters of monocrystalline Cu.</div>

Nanomaterials and Nanotechnology

tab2

Table 2

Table 2: Material Removal Mechanism and Evolution of Subsurface Defects during Nanocutting of Monocrystalline Cu 