Research Article
Boiling Heat Transfer and Critical Heat Flux Enhancement Using Electrophoretic Deposition of SiO2 Nanofluid
Table 1
Contact angle and thickness of various coated surfaces.
| | Case | Contact angle (°C) |
| | Bare plate | 88.4 | | 20 minute with 0.5% nanofluid | 77.4 | | 60 minute with 0.5% nanofluid | 45.5 | | Sintered at 200°C | 37.4 | | Sintered at 500°C | 24.6 | | Sintered at 700°C | 12.9 | | Sintered at 800°C | 5.4 |
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