Research Article

Thermomechanical Characterisation of Copper Diamond and Benchmarking with the MultiMat Experiment

Table 4

Summary of the material model for CuCD RHP3434 at room temperature.

PropertyValueUncertaintyUnits

Density5700±33kg·m−3
Specific heat capacity407±12J·kg−1 K−1
Thermal conductivity537±15W·m−1 K−1
Coefficient of thermal expansion6.19±0.210−6 K−1
Young’s modulus194±32GPa
Poisson’s ratio0.2480.002