Analysis of Vibration Transmission Path in Packaging System and Design of Teaching Experiment

<table class="table-group" id="tab1"><tr><td><table class="table"><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr class="thead"><td class="align_left">Computer mainframe components</td><td class="align_center">Selected key components</td></tr><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr><td class="align_left">Power source</td><td class="align_center">Computer motherboard</td></tr><tr><td class="align_left">Display card</td><td class="align_center">Hard disk</td></tr><tr><td class="align_left">Computer motherboard</td><td class="align_center">—</td></tr><tr><td class="align_left">Hard disk</td><td class="align_center">—</td></tr><tr><td class="align_left">Fan</td><td class="align_center">—</td></tr><tr class="table-tr"><td colspan="2"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>Computer mainframe components and selected key components.</div>

Shock and Vibration

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Table 1

Table 1: Analysis of Vibration Transmission Path in Packaging System and Design of Teaching Experiment 