Research Article
Material Removal Mechanism and Evolution of Subsurface Defects during Nanocutting of Monocrystalline Cu
Table 2
3D nanocutting parameters of monocrystalline Cu.
| Parameters | Values |
| Tool crystal structure | Cubic diamond | Tool thickness (y-direction) | 3.0 nm | Take angle | 15° | Flank angle | 8° | Cutting direction | (0 1 0) [ 0 0] | Cutting distance | 25 nm | Cutting depth | 4.0 nm | Timestep | 2 fs | Relaxation time (NVT) | 50 ps |
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